In order to divide the ceramic substrate into independent parts, a laser marking machine can be used to carve (drill) a series of local (unobstructed) high tolerance holes. These holes penetrate approximately one-third of the substrate, generating priority fault lines for later rupture. Other techniques can also be used to process pathways, grooves, determine morphology, and fine patterns on the substrate.
Due to the absorption properties of commonly used ceramics, CO2 lasers have become the choice of lasers. The energy of the pulsed CO2 laser beam is absorbed on the ceramic surface, resulting in local heating, melting, and vaporization. Figure 2 shows the top view of the 0.0045 inch line inside the alumina, indicating the heat affected zone (HAZ) caused by local melting below the low-energy edge in the Gaussian beam energy distribution map during relatively long pulse periods (approximately 75-300m, depending on thickness).
For many years, CO2 lasers have consumed a significant amount of resources in terms of gas and energy during long-term shifts, and require the development of maintenance plans. In addition, the typical pulse parameters used for this application mean that sealed tube CO2 laser technology is not very suitable. Overall, after years of significant improvements, CO2 lasers still lag behind other technologies in terms of reliability and maintenance issues. During maintenance, the beam quality of these lasers is still prone to change; The minimum achievable spot size is also easily affected by long waves. On its own, the absorption characteristics of ceramic laser beams have influenced this technology in the market for a long time.