CO2 laser marking machine is a machine that uses a laser beam to permanently mark various surfaces of different substances. The effect of marking is to expose deep substances through the evaporation of surface substances, thereby carving exquisite patterns, trademarks, dates, logos, or text. Currently, CO2 laser marking machines are mainly used in situations that require more precision and precision. Applied in industries such as food, medicine, alcohol, electronic components, integrated circuits (ICs), electrical appliances, mobile communication, building materials, PVC pipes, etc., the main advantages of CO2 laser marking machines and inkjet printers are the lack of consumables and permanence.
Laser marking is the use of a laser beam to permanently mark the surface of various substances. The effect of marking is to expose deeper substances through the evaporation of surface substances, or to "engrave" traces of surface substances through chemical and physical changes caused by light energy, or to burn off some substances through light energy to display the desired etched patterns and text.
There are two recognized principles:
Thermal processing is a laser beam with high energy density (which is a concentrated energy flow) that is irradiated on the surface of the processed material. The material surface absorbs laser energy and generates a thermal excitation process in the irradiation area, causing the temperature of the material surface (or coating) to rise, resulting in phenomena such as deformation, melting, ablation, and evaporation.
Cold processing involves photons with high energy load (ultraviolet), which can break chemical bonds in materials (especially organic materials) or surrounding media, causing non thermal process damage to the material. This type of cold processing has special significance in laser marking processing because it is not thermal ablation, but rather a cold peeling that does not produce "thermal damage" side effects and breaks chemical bonds. Therefore, it does not produce heating or thermal deformation on the inner layer and nearby areas of the processed surface. For example, in the electronics industry, excimer lasers are used to deposit chemical thin films on substrate materials and create narrow grooves on semiconductor substrates.