Machine Introduction
CO2 Laser Die Cutter, industrial-grade roll-to-roll system, equipped with 250W Luxinar CO2 RF laser tube and CKLASER 50mm high-speed Galvo scanning head, designed for high-precision label and thin-film material processing.




Machine Parameters
|
Laser Source |
250 watts Luxinar RF metal laser tube |
|
Wave Length |
10640nm |
|
Laser Beam Quality |
1.2<㎡ |
|
Galvo Head |
CKLASER Super 50mm scan head |
|
Scanning Speed of Glavo |
12000mm/s |
|
Control Software |
3DLaser marking software is compatible with AutoCAD, CorelDraw and other image format files. Marking of all truetype fonts and contents in various formats |
|
Marking Range |
350*350mm(13.78"*13.78") |
|
Laser Beam Width |
0.1mm |
|
Galvanometer scanning positioning accuracy |
0.001mm |
|
Galvanometer scanning repeating accuracy |
0.01mm |
|
Cooling method |
Water cooling |
|
Power supply |
AC220V±2%,50Hz |
|
PC Minimum Requirement |
Computer, Windows XP operating system, 19-inch LCD monitor, memory 4G, hard disk 500G. |
|
Environment Requirement |
working temperature 15-30℃ humidity 20%-80% storage temperature -20-50℃ |
|
Standard Configuration |
Tension sensor, motorized lift |
|
Optional Configuration |
Motorized full housing |
Machine Advantages
2. Key Advantages
High-speed laser cutting for any graphic design
Wide material compatibility: paper, films, and composite materials
No need to change dies, reducing maintenance costs
Software compatible with multiple graphics and font formats
Flexible configuration with automatic splicing, separate winding, and production line options
3. Key Features
Stable Laser System
Luxinar 250W CO2 RF laser tube with CKLASER high-speed Galvo head
CCD camera visual positioning and automatic deviation correction for micron-level accuracy
High-Speed, Efficient Processing
Galvo scanning speed up to 12,000mm/s
Supports roll-to-roll continuous operation and batch production
Industrial-Grade Structure with Expandable Options
Equipped with tension sensors and motorized lift
Optional full enclosure and flexible splicing/winding functions

Machine Applications
Applicable Materials:
Paper, cardboard
Films: PP, PET, polyimide
Reflective films, industrial tapes, composite films
Typical Applications:
Label laser die cutting and trimming
OEM/ODM component marking
High-volume production and thin-film processing
Simultaneous marking, scoring, and perforating functions

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